AMD SP3 1U Server CPU Heat Sink with Copper Bottom Cooling Chip & Uniform Heating Version
| Model |
TC009 |
| Type |
AMD Heat Sink |
| Texture of Material |
Copper Aluminum Bonding |
| Bearing Type |
Double Ball Bearings |
To better ensure the safety of your goods, professional, environmentally friendly, convenient and efficient packaging services will be provided.
Q1
What socket is this CPU heat sink designed for?
This heat sink is specifically designed for the AMD SP3 socket, making it compatible with high-performance 1U server architectures.
Q2
What are the primary materials used in the construction of Model TC009?
The heat sink uses a copper aluminum bonding texture, combining the superior thermal conductivity of copper at the base with the efficient heat dissipation of aluminum.
Q3
What type of bearing does the cooling fan utilize?
It features double ball bearings, ensuring a long lifespan, reduced friction, and reliable performance under continuous heavy-duty operation.
Q4
Is this cooling chip suitable for high-power server environments?
Yes, this model features a uniform heating plate and a high-power copper bottom, making it highly effective for cooling demanding enterprise-class CPUs.
Q5
How is the product packaged to prevent damage during shipping?
To guarantee the safety of your products, we provide professional, eco-friendly, secure, and highly efficient packaging solutions specifically tailored for server components.
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